Wending Mai
William Mai received the B.S. degree in electronic information science and technology, M.S. degree in radio physics, and Ph.D. degree in electromagnetic and microwave technology from the University of Electronic Science and Technology of China, Chengdu, China, in 2007, 2010, and 2019 respectively.
In 2009, he was a Student Researcher in the Lenovo Research Institute, Chengdu. From 2010 to 2012, he was a Engineer in Texas Instruments Incorporated, Dallas, TX, USA.. From 2017 to 2022, he was a Visiting Scholar and a Postdoc in the Pennsylvania State University, University Park, PA, USA. Since 2022, he has been a Senior Research and Development Engineer in Ansys HFSS. His current research interests include knot electromagnetics, computational electromagnetics, and adaptive mesh refinement.
Dr. Mai is a Senior Member of the Institute of Electrical and Electronics Engineers (IEEE), a Member of the Applied Computational Electromagnetics Society (ACES), and a Member of OPTICA.
Location
State College
Disciplines
Affiliation
Ansys